Fully Automated High-Speed SMT Production Line – Industrial-Grade Precision & Efficiency

This fully automated SMT line (total length 13.2 meters) integrates a high-precision solder paste printer, a 10-head ultra-fast chip mounter (42,000 CPH), and a 6-head multi-functional placement machine (30,000 CPH) for large componentsICs, achieving ±0.035mm ultra-fine placement accuracy. Priced competitively at $70,000–80,000 USD, this turnkey solution is engineered for high-volume OEMODM manufacturing, delivering unmatched productivity for telecom infrastructure, industrial automation, and automotive electronics.

Key Features & Benefits
✔ Blazing-Fast Dual-Stage Placement – Combines 42,000 CPH (10-head) + 30,000 CPH (6-head) for balanced throughput across tiny passives (020101005) and large ICs (QFP, BGA, connectors).
✔ Sub-40μm Precision – ±0.035mm accuracy with laser calibration + 3D vision, ensuring CPK≥1.33 process stability for mission-critical applications.
✔ End-to-End Automation – Includes automatic PCB conveyor, stencil cleaning, and optional SPIAOI for closed-loop quality control.
✔ Industry 4.0 Ready – IoT-enabled monitoring (OEE, defect tracking) with 0.5% misplacement rate at full speed.
✔ High-Mix Flexibility – Handles 01005 to 150mm x 100mm components, supporting LED arrays, power modules, and automotive ADAS boards.

Performance Metrics
◉ Throughput 1,200–1,500 PCBsday (varies by design complexity)
◉ Uptime 90% with preventive maintenance
◉ Supported Components 020101005 resistors, 0.3mm-pitch QFN, 60x60mm BGAs, and heavy connectors (up to 150g)

Target Industries
• 5GTelecom Massive MIMO antennas, RF transceivers
• Automotive ECU, radar PCBs, EV battery management
• Industrial PLCs, motor drives, robotic controllers