Composition of SMT production line
The pick and place machine (Surface Mount Technology, SMT) is an automated equipment used for electronic assembly, used to install surface mount components (Surface Mount Device, SMD) on circuit boards. The following are the main components of the production line:
1. Screen Printer: The first part of the pick and place machine is the stencil printer, which is used to accurately print solder paste on the pads of the circuit board. It includes a stencil and a scraper. The solder paste is evenly printed on the circuit board through the pressure of the scraper scraping across the stencil.
2. Pick and Place Machine: The pick and place machine is the core component of the production line. It is used to remove surface mount components from the feeder and accurately place them at the predetermined position on the circuit board. The pick and place machine usually includes multiple nozzles that can handle multiple components at the same time. It features a high-precision positioning system to ensure correct mounting of components.
3.Feeders: Feeders are devices used in pick and place machines to store and provide surface mount components. Each component type usually has a corresponding feeder that contains a large number of components for use by the mounting head. Feeders usually have automatic feeding mechanisms to ensure continuous feeding.
4. Conveyor System: The conveyor system is used to transport circuit boards from one work area to the next for continuous assembly processes. It usually consists of a conveyor belt or transfer device to ensure accurate positioning and smooth transfer of circuit boards.
5. Inspection System: Pick and place machines are usually equipped with various inspection systems to check the quality and accuracy of the assembly process. These systems may include vision inspection systems, sensors, and other inspection equipment to detect correct component mounting, offset, flipping, defects, etc.
6. Reflow Oven: The reflow oven is used to perform the welding process after completing the component installation. It heats the circuit board to the melting point of the solder paste, causing the solder paste to melt and connect the components to the circuit board.
The above are the main components of the pick and place machine. Different pick and place machines may have some additional functions and modules to adapt to specific application requirements. The automation and high-precision features of pick and place machines make the electronic assembly process more efficient and reliable.
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